本设备主要用于指纹模块DAF贴附及热压,陶瓷盖板贴附及热压,主体部分分为5部分:DAF贴附、DAF热压、撕膜、陶瓷盖板贴附、陶瓷盖板热压。
The equipment is mainly used for DAF attaching and hot-pressing, ceramic cover attaching and hot-pressing of fingerprint module , the main body part is divided into five parts: DAF attaching, DAF hot-pressing, film peeling, ceramic cover attaching, ceramic cover hot-pressing.